Company Filing History:
Years Active: 2014-2025
Title: Soungsoo Kim: Innovator in High Density Interconnect Printed Circuit Boards
Introduction
Soungsoo Kim is a prominent inventor based in Berlin, Germany. He has made significant contributions to the field of printed circuit board technology, particularly in high density interconnect (HDI) designs. With a total of 5 patents to his name, Kim's work has advanced the capabilities of electronic components.
Latest Patents
One of his latest patents is a method of preparing a high density interconnect printed circuit board that includes microvias filled with copper. This invention refers to a method that enhances the preparation of HDI PCBs or integrated circuit substrates, which include through-holes and/or grate structures filled with copper. This innovative approach is crucial for improving the performance and reliability of electronic devices.
Career Highlights
Throughout his career, Soungsoo Kim has worked with notable companies such as Atotech Deutschland GmbH and Atotech Deutschland GmbH & Co. KG. His experience in these organizations has allowed him to refine his skills and contribute to cutting-edge technology in the electronics industry.
Collaborations
Some of his coworkers include Bert Reents and Bernd Roelfs. Their collaboration has likely fostered an environment of innovation and creativity, leading to advancements in their respective fields.
Conclusion
Soungsoo Kim's contributions to the field of printed circuit boards are noteworthy. His innovative methods and collaborations have positioned him as a key figure in the advancement of HDI technology. His work continues to influence the electronics industry and pave the way for future innovations.