Berlin, Germany

Kai-Jens Matejat

USPTO Granted Patents = 7 

 

Average Co-Inventor Count = 3.2

ph-index = 4

Forward Citations = 32(Granted Patents)


Location History:

  • Lämmerweide, DE (2005)
  • Oberkrämer, DE (2009)
  • Berlin, DE (2013 - 2024)

Company Filing History:


Years Active: 2005-2024

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7 patents (USPTO):Explore Patents

Title: Innovations by Inventor Kai-Jens Matejat

Introduction

Kai-Jens Matejat is a prominent inventor based in Berlin, Germany. He has made significant contributions to the field of printed circuit board technology. With a total of 7 patents to his name, his work focuses on enhancing the manufacturing processes and efficiency of high-density interconnect printed circuit boards.

Latest Patents

Among his latest patents, one notable invention is related to manufacturing sequences for high-density interconnect printed circuit boards. This invention involves a method of preparing a high-density interconnect printed circuit board (HDI PCB) that includes microvias filled with copper. Another significant patent pertains to a method of forming a solderable solder deposit on a contact pad. This method includes several steps, such as providing an organic, non-conductive substrate and electrolytically depositing nickel or nickel alloy into an activated opening.

Career Highlights

Kai-Jens Matejat has worked with Atotech Deutschland GmbH and Atotech Deutschland GmbH & Co. KG, where he has applied his expertise in printed circuit board technology. His innovative approaches have contributed to advancements in the industry.

Collaborations

Throughout his career, he has collaborated with notable professionals, including Sven Lamprecht and Ingo Ewert. These collaborations have further enriched his work and expanded the impact of his inventions.

Conclusion

Kai-Jens Matejat's contributions to the field of printed circuit boards demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of technology and a drive to improve manufacturing processes.

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