The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2014
Filed:
Jun. 23, 2011
Sven Lamprecht, Berlin, DE;
Kai-jens Matejat, Berlin, DE;
Ingo Ewert, Berlin, DE;
Stephen Kenny, Berlin, DE;
Sven Lamprecht, Berlin, DE;
Kai-Jens Matejat, Berlin, DE;
Ingo Ewert, Berlin, DE;
Stephen Kenny, Berlin, DE;
Atotech Deutschland GmbH, Berlin, DE;
Abstract
Described is a method of forming a solder deposit on a substrate comprising the following steps i) provide a substrate that includes at least one inner contact area, ii) contact the entire substrate area including the at least one inner contact area with a solution suitable to provide a conductive layer on the substrate surface, iii) form a patterned resist layer, iv) electroplate a solder deposit layer containing a tin or tin alloy onto the inner contact area, v) remove the patterned resist layer, vi) form a solder resist layer having solder resist openings on the substrate surface.