The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2025
Filed:
Jun. 29, 2021
Applicant:
Atotech Deutschland Gmbh & Co. KG, Berlin, DE;
Inventors:
Heiko Brunner, Berlin, DE;
Sandra Heyde, Berlin, DE;
Peter Haack, Berlin, DE;
Angela Llavona-Serrano, Berlin, DE;
Assignee:
Atotech Deutschland GmbH & Co. KG, Berlin, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 3/38 (2006.01); C25D 5/02 (2006.01);
U.S. Cl.
CPC ...
C25D 3/38 (2013.01); C25D 5/02 (2013.01);
Abstract
The invention relates to aqueous acidic plating baths for electrodeposition of copper and copper alloys in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises copper ions, at least one acid and an ureylene polymer. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.