Asia Electronic Material Co., Ltd.

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USPTO Granted Patents = 7

Forward Citations = 6

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7 inventors (with patents filed for the assignee):

Chien-Hui Lee (7 out of 7 patents)

Chih-Ming Lin (6 out of 33 patents)

Wei-Chih Lee (2 out of 2 patents)

4. Shou-Jui Hsiang (2 out of 2 patents)

5. Li-Chih Yang (1 out of 1 patent)

6. Hui-Feng Lin (1 out of 1 patent)

7. Chia-Hua Ho (1 out of 1 patent)

7 patents: Sort by Forward Citations

1. 12233622 - Electromagnetic interference shielding film and preparing methods thereof (2025-02-25),

2. 11634612 - Multi-layered anisotropic conductive adhesive having conductive fabric and preparation thereof (2023-04-25),

3. 11116074 - Colored thin covering film and manufacturing method (2021-09-07),

4. 10822529 - Multi-layered anisotropic conductive adhesive having conductive fabric and preparation thereof (2020-11-03),

5. 10412866 - Cover film (2019-09-10),

6. 8765258 - Cover film (2014-07-01),

7. 8536460 - Composite double-sided copper foil substrates and flexible printed circuit board structures using the same (2013-09-17),

Company Overview

Asia Electronic Material Co., Ltd. is a leading manufacturer and supplier of electronic materials in Asia. With a focus on innovation and quality, the company offers a wide range of products including PCB materials, soldering materials, and electronic components. Established in 2005, Asia Electronic Material Co., Ltd. has quickly expanded its presence in the market and gained a reputation for reliable products and excellent customer service.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 27 2026

7 Patents

#291 in Hsinchu

#1,853 in Taiwan

Hsinchu, Taiwan