Company Filing History:
Years Active: 2019
Title: Hui-Feng Lin: Innovator in Electromagnetic Shielding Technology.
Introduction
Hui-Feng Lin is a notable inventor based in Zhubei, Taiwan. He has made significant contributions to the field of electronic materials, particularly in the development of innovative cover films designed to shield against electromagnetic interference.
Latest Patents
Hui-Feng Lin holds a patent for a cover film that includes a conductive adhesive layer, an electromagnetic shielding layer, and an insulating layer. The electromagnetic shielding layer has a thickness ranging from 0.01 to 25 micrometers, allowing the cover film to effectively shield electromagnetic interference through the thinner interposed layer. This innovation is crucial for enhancing the performance and reliability of electronic devices.
Career Highlights
Hui-Feng Lin is currently employed at Asia Electronic Material Co., Ltd., where he continues to advance his research and development efforts in electronic materials. His work has positioned him as a key figure in the industry, contributing to the evolution of materials that enhance device functionality.
Collaborations
Some of his notable coworkers include Chih-Ming Lin and Chien-Hui Lee, who collaborate with him on various projects within the company.
Conclusion
Hui-Feng Lin's innovative work in electromagnetic shielding technology exemplifies the importance of advancements in electronic materials. His contributions are paving the way for improved electronic device performance and reliability.