The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2013
Filed:
Oct. 29, 2010
Chih-ming Lin, Hsinchu, TW;
Shou-jui Hsiang, Hsinchu, TW;
Chien-hui Lee, Hsinchu, TW;
Asia Electronic Material Co., Ltd., Hsinchu, TW;
Abstract
A double-sided copper foil substrate, which comprises: a polymer layer; a first copper foil; an adhesive layer formed on the polymer layer such that the polymer layer is sandwiched between the adhesive layer and the first copper layer; and a second copper foil causing the adhesive layer to be sandwiched between the second copper foil and the polymer layer, wherein the polymer layer and the adhesive layer have a total thickness of from 12 to 25 μm. The present invention further provides a flexible printed circuit board structure utilizing the composite double-sided copper foil substrate of the present invention, wherein the second double-sided copper foil substrate has a trench for exposing a portion of the adhesive layer. The double-sided copper foil substrate of the present invention are lower in rebound and satisfying the demand for the greater number of bending and sliding cycles under a lower R angle, and particularly is suitable for thin and flexible electronic products.