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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12233622 B1

PDFFull Text
Date of Patent:
Feb. 25, 2025

Filed:

Aug. 30, 2022

Electromagnetic interference shielding film and preparing methods thereof

Applicant:

Asia Electronic Material Co., Ltd., Hsin-Chu County, TW;

Inventors:

Wei-Chih Lee, Hsin-Chu County, TW;

Chih-Ming Lin, Hsin-Chu County, TW;

Chia-Hua Ho, Hsin-Chu County, TW;

Chien-Hui Lee, Hsin-Chu County, TW;

Assignee:

ASIA ELECTRONIC MATERIAL CO., LTD., Hsin-Chu County, TW;

Attorney:

Amin, Turocy & Watson, LLP

Primary Examiner:

Alicia J Weydemeyer

Int. Cl.
CPC ...
B32B 15/08 (2006.01); B32B 7/12 (2006.01); B32B 15/20 (2006.01); B32B 27/18 (2006.01); B32B 27/28 (2006.01); B32B 37/12 (2006.01); B32B 37/18 (2006.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
B32B 15/08 (2013.01); B32B 7/12 (2013.01); B32B 15/20 (2013.01); B32B 27/18 (2013.01); B32B 27/281 (2013.01); B32B 37/12 (2013.01); B32B 37/182 (2013.01); H05K 9/0088 (2013.01); B32B 2264/1022 (2020.08); B32B 2264/108 (2013.01); B32B 2305/026 (2013.01); B32B 2307/206 (2013.01); B32B 2307/212 (2013.01); B32B 2307/4026 (2013.01); B32B 2307/406 (2013.01); B32B 2307/536 (2013.01); B32B 2307/538 (2013.01); B32B 2307/732 (2013.01); B32B 2307/748 (2013.01); B32B 2311/04 (2013.01); B32B 2311/08 (2013.01); B32B 2311/12 (2013.01); B32B 2311/14 (2013.01); B32B 2311/16 (2013.01); B32B 2311/22 (2013.01); B32B 2311/24 (2013.01); B32B 2311/30 (2013.01); B32B 2367/00 (2013.01); B32B 2379/08 (2013.01); B32B 2457/00 (2013.01);
Abstract

An electromagnetic interference shielding film includes an insulation layer, a first adhesive layer, a porous metal layer and a conductive adhesive layer including a plurality of conductive particles. The first adhesive layer is located between the insulation layer and the porous metal layer, and the porous metal layer is formed on the first adhesive layer, and making the first adhesive layer locate between the porous metal layer and the insulation layer. The conductive adhesive layer is located on the porous metal layer so that the porous metal layer is located between the first adhesive layer and the conductive adhesive layer. The present invention further provides a preparation method thereof.

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