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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11634612 B1

PDFFull Text
Date of Patent:
Apr. 25, 2023

Filed:

Sep. 28, 2020

Multi-layered anisotropic conductive adhesive having conductive fabric and preparation thereof

Applicant:

Asia Electronic Material Co., Ltd., Hsinchu County, TW;

Inventors:

Chih-Ming Lin, Zhubei, TW;

Chien-Hui Lee, Zhubei, TW;

Assignee:

ASIA ELECTRONIC MATERIAL CO., LTD., Hsinchu County, TW;

Attorney:

Amin, Turocy & Watson, LLP

Primary Examiner:

Maria V Ewald

Assistant Examiner:

Ethan A Utt

Int. Cl.
CPC ...
C09J 7/29 (2018.01); C09J 7/38 (2018.01); H01B 1/02 (2006.01); C09J 7/28 (2018.01); C09J 9/02 (2006.01); C09J 7/40 (2018.01); C09J 7/30 (2018.01); H01B 1/22 (2006.01); C08K 3/08 (2006.01); C08K 7/00 (2006.01); C25D 5/12 (2006.01); C25D 3/02 (2006.01); C25D 5/00 (2006.01);
U.S. Cl.
CPC ...
C09J 7/29 (2018.01); C09J 7/28 (2018.01); C09J 7/30 (2018.01); C09J 7/385 (2018.01); C09J 7/401 (2018.01); C09J 9/02 (2013.01); C25D 3/02 (2013.01); C25D 5/12 (2013.01); C25D 5/605 (2020.08); H01B 1/026 (2013.01); H01B 1/22 (2013.01); C08K 3/08 (2013.01); C08K 7/00 (2013.01); C08K 2201/001 (2013.01); C09J 2203/326 (2013.01); C09J 2301/124 (2020.08); C09J 2301/208 (2020.08); C09J 2301/302 (2020.08); C09J 2301/314 (2020.08); C09J 2301/408 (2020.08); C09J 2400/163 (2013.01); C09J 2400/263 (2013.01); C09J 2433/00 (2013.01); C09J 2467/005 (2013.01); Y10T 428/1452 (2015.01); Y10T 428/1476 (2015.01); Y10T 428/24959 (2015.01); Y10T 428/256 (2015.01); Y10T 428/287 (2015.01); Y10T 428/2852 (2015.01); Y10T 428/2874 (2015.01); Y10T 428/2891 (2015.01); Y10T 428/2896 (2015.01);
Abstract

Provided is a multi-layered anisotropic conductive adhesive including an upper conductive adhesive layer, a conductive fabric layer with two sides and a lower conductive adhesive layer, wherein one side of the conductive fabric layer is plated with metal. In the application of a flexible printed circuit, reinforced parts, formed by laminating multi-layered anisotropic conductive adhesive with steel or polyimide-type stiffener, can effectively prevent the deformation of installed parts due to warping, and ensure the good hole filling, good direct grounding effect, and good shielding performance. Therefore, the multi-layered anisotropic conductive adhesive has good electrical properties, good adhesive strength, better tin soldering, reliability and flame resistant. Also provided is a method of producing the multi-layered anisotropic conductive adhesive.

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