For the Inventor, By the Inventor

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Bayan Lepas, Malaysia

Ase Electronics (m) Sdn Bhd

USPTO Granted Patents = 3

Forward Citations = 105

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10 inventors (with patents filed for the assignee):

Kam Cheong Chung (1 out of 1 patent)

Ahmad Zulmuhtasyim (1 out of 1 patent)

Liang Peng Cheng (1 out of 1 patent)

4. Lai Theng Chan (1 out of 1 patent)

5. Robert M Hilton (1 out of 6 patents)

6. Salmi Abdul Rahman (1 out of 1 patent)

7. Heng Ee Ooi (1 out of 1 patent)

8. Chin Yee Fong (1 out of 1 patent)

9. Siew Leong Chaw (1 out of 1 patent)

10. Sabran Bin Samsuri (1 out of 3 patents)

3 patents: Sort by Forward Citations

1. 9722098 - Semiconductor device package and method of manufacturing the same (2017-08-01),

2. 6940182 - Flip-chip package with underfill dam for stress control (2005-09-06),

3. 6773828 - Surface preparation to eliminate whisker growth caused by plating process interruptions (2004-08-10),

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USPTO Data Jan 1 1976 - Dec 30 2025

3 Patents

#4 in Bayan Lepas

#189 in Malaysia

Bayan Lepas, Malaysia

Ase Electronics (m) Sdn Bhd

Forward Citations = 105

10 inventors:

Kam Cheong Chung (1 out of 1 patent)

Ahmad Zulmuhtasyim (1 out of 1 patent)

Liang Peng Cheng (1 out of 1 patent)

4. Lai Theng Chan (1 out of 1 patent)

5. Robert M Hilton (1 out of 6 patents)

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