Chin Yee Fong

Title: Innovations by Chin Yee Fong in Electroplating Processes.

Introduction

Chin Yee Fong is a notable inventor based in Penang, Malaysia. He has made significant contributions to the field of electroplating, particularly in reducing whisker growth during the plating process. His innovative approach addresses a common challenge faced in the industry.

Latest Patents

Chin Yee Fong holds a patent for a process titled "Surface preparation to eliminate whisker growth caused by plating process interruptions." This electroplating process effectively reduces the whisker formation rate that results from interruptions during the electroplating of alloys. The method involves forming a tin strike or a thin layer of pure metal on the alloy during an activation operation. This ensures that any interruption in the electroplating process etches the pure metal layer rather than the alloy, preventing unacceptable roughening of the workpiece's surface. An exemplary embodiment of this process involves forming a tin strike on a predominantly copper lead frame, followed by the application of an Sn-Pb solder layer that is significantly thicker than the tin strike layer.

Career Highlights

Chin Yee Fong is currently employed at Ase Electronics (M) Sdn Bhd, where he continues to apply his expertise in electroplating. His work has been instrumental in advancing the company's capabilities in producing high-quality electronic components.

Collaborations

Chin Yee Fong collaborates with talented coworkers, including Heng Ee Ooi and Salmi Abdul Rahman. Their combined efforts contribute to the innovative environment at Ase Electronics.

Conclusion

Chin Yee Fong's contributions to the field of electroplating through his patented process demonstrate his commitment to innovation and excellence. His work not only addresses industry challenges but also enhances the quality of electronic components produced by his company.