The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 01, 2017
Filed:
Oct. 18, 2016
Ase Electronics (M) Sdn Bhd, Bayan Lepas, Penang, MY;
Kam Cheong Chung, Paya Terubong, MY;
Ahmad Zulmuhtasyim, Bayan Lepas, MY;
Liang Peng Cheng, Gelugor, MY;
Lai Theng Chan, Balik Pulau, MY;
ASE ELECTRONICS (M) SDN BHD, Bayan Lepas, MY;
Abstract
A method of manufacturing a semiconductor device package includes disposing at least one die over a substrate, dispensing a liquid material on the die, and curing the liquid material so that the liquid material forms a protective layer attached to a portion of the die. The method further includes forming an encapsulant covering at least a portion of the substrate and a portion of the die, where the protective layer is exposed from the encapsulant in a cavity defined by the encapsulant. The method further includes removing the protective layer from the die, and disposing a cap over the cavity.