Lai Theng Chan

Title: The Innovations of Lai Theng Chan

Introduction

Lai Theng Chan is a notable inventor based in Balik Pulau, Malaysia. He has made significant contributions to the field of semiconductor technology. His innovative approach has led to the development of a unique semiconductor device package.

Latest Patents

Lai Theng Chan holds a patent for a semiconductor device package and the method of manufacturing the same. This patent describes a method that includes disposing at least one die over a substrate, dispensing a liquid material on the die, and curing the liquid material to form a protective layer attached to a portion of the die. The method further involves forming an encapsulant that covers at least a portion of the substrate and die, with the protective layer exposed from the encapsulant in a cavity defined by it. Additionally, the method includes removing the protective layer from the die and disposing a cap over the cavity.

Career Highlights

Lai Theng Chan is currently employed at Ase Electronics (M) Sdn Bhd, where he continues to innovate in the semiconductor industry. His work has been instrumental in advancing manufacturing techniques and improving product reliability.

Collaborations

Lai Theng Chan collaborates with talented coworkers, including Kam Cheong Chung and Ahmad Zulmuhtasyim. Their combined expertise fosters a creative environment that drives innovation.

Conclusion

Lai Theng Chan's contributions to semiconductor technology exemplify the spirit of innovation. His patent and work at Ase Electronics (M) Sdn Bhd highlight his commitment to advancing the field.