Penang, Malaysia

Heng Ee Ooi


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 11(Granted Patents)


Company Filing History:


Years Active: 2004

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1 patent (USPTO):Explore Patents

Title: Innovations by Heng Ee Ooi in Electroplating Technology.

Introduction

Heng Ee Ooi is a notable inventor based in Penang, Malaysia. He has made significant contributions to the field of electroplating, particularly in reducing whisker growth during the plating process. His innovative approach addresses a common challenge faced in the industry, showcasing his expertise and dedication to advancing technology.

Latest Patents

Heng Ee Ooi holds a patent for a process titled "Surface preparation to eliminate whisker growth caused by plating process interruptions." This electroplating process effectively reduces the formation rate of whiskers that can occur due to interruptions during the electroplating of alloys. The method involves creating a tin strike or a thin layer of pure metal on the alloy during an activation operation. This ensures that any interruption in the electroplating process etches the pure metal layer rather than the alloy, preventing unacceptable roughening of the workpiece's surface. An exemplary embodiment of this process involves forming a tin strike on a predominantly copper lead frame, followed by the application of an Sn-Pb solder layer that is significantly thicker than the tin strike layer.

Career Highlights

Heng Ee Ooi is currently employed at Ase Electronics (M) Sdn Bhd, where he continues to apply his innovative techniques in electroplating. His work has not only contributed to the company's success but has also positioned him as a key figure in the field of electroplating technology.

Collaborations

Heng Ee Ooi collaborates with talented coworkers, including Salmi Abdul Rahman and Chin Yee Fong. Their combined expertise fosters a productive environment that encourages innovation and the development of advanced solutions in their industry.

Conclusion

Heng Ee Ooi's contributions to electroplating technology through his innovative patent demonstrate his commitment to solving industry challenges. His work at Ase Electronics (M) Sdn Bhd and collaborations with skilled colleagues further enhance his impact in the field.

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