Company Filing History:
1 out of 8 
1 out of 3 
2 out of 832,880 Years Active: 2003-2005
Title: Innovations by Sabran Bin Samsuri
Introduction
Sabran Bin Samsuri is a notable inventor based in Penang, Malaysia. He has made significant contributions to the field of semiconductor packaging, holding a total of three patents. His work focuses on improving the reliability and performance of flip-chip packages.
Latest Patents
One of his latest patents is a "Flip-chip package with underfill dam for stress control." This invention introduces a dam or barrier around the periphery of a die in a flip-chip package. The dam changes the shape of the underfill to reduce stress resulting from edge effects. It includes a treated region of a substrate that has an affinity for the underfill material, causing the liquid underfill to bead. This beading controls the wetting angle of the underfill material and shapes it to eliminate stress sources, such as underfill fillet regions that are prone to significant shrinkage.
Another significant patent is the "Flip-chip packaging method that treats an interconnect substrate to control stress created at edges of fill material." This method treats a portion of an interconnect substrate so that the fill material beads when liquid. The beading prevents the formation of fillets that could create variations in the thermal coefficient of expansion of the fill material and warp the interconnect substrate. The treated portion can be roughened or coated with a different material, enhancing the beading effect.
Career Highlights
Sabran has worked with various companies, including Celerity Research Pte. Ltd. His experience in the semiconductor industry has allowed him to develop innovative solutions that address common challenges in flip-chip packaging.
Collaborations
He has collaborated with notable professionals in his field, including Robert M. Hilton. Their joint efforts have contributed to advancements in semiconductor technology.
Conclusion
Sabran Bin Samsuri's innovative patents and career achievements highlight his significant impact on the semiconductor industry. His work continues to influence the development of reliable and efficient packaging solutions.