The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2004
Filed:
Dec. 11, 2001
Robert M. Hilton, Burpengary, AU;
Sabran B. Samsuri, Penang, MY;
Other;
Abstract
A flip-chip packaging method for a semiconductor device treats a portion of an interconnect substrate so that a fill material when liquid beads on the treated portion of the interconnect substrate. When the fill material is dispensed on the interconnect substrate to fill a gap under the semiconductor device, the beading of the fill material prevents formation of fillets that might otherwise create a variation in the thermal coefficient of expansion of fill material and/or warp the interconnect substrate. The treated portion of the interconnect substrate can be roughened or coated with a material that differs from other portions of the interconnect substrate and thereby causes beading.