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Advanced Interconnect Materials, LLC

USPTO Granted Patents = 23

% Expired Patents = 52.2

EPO Patents = 1

Forward Citations = 178

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6 inventors (with patents filed for the assignee):

Junichi Koike (23 out of 56 patents)

Hideaki Kawakami (9 out of 37 patents)

Akihiro Shibatomi (9 out of 10 patents)

4. Pilsang Yun (3 out of 3 patents)

5. Mayumi Naito (1 out of 1 patent)

6. Kouji Neishi (1 out of 1 patent)

23 patents: Sort by Forward Citations

1. 9123821 - Electrode for oxide semiconductor, method of forming the same, and oxide semiconductor device provided with the electrode (2015-09-01),

2. 9082821 - Method for forming copper interconnection structures (2015-07-14),

3. 8895978 - Semiconductor device (2014-11-25),

4. 8866140 - Thin-film transistor (2014-10-21),

5. 8531033 - Contact plug structure, semiconductor device, and method for forming contact plug (2013-09-10),

6. 8420535 - Copper interconnection, method for forming copper interconnection structure, and semiconductor device (2013-04-16),

7. 8372745 - Semiconductor device, its manufacturing method, and sputtering target material for use in the method (2013-02-12),

8. 8324730 - Copper interconnection structure and method for forming copper interconnections (2012-12-04),

9. 8258626 - Copper interconnection, method for forming copper interconnection structure, and semiconductor device (2012-09-04),

10. 8188599 - Semiconductor device, its manufacturing method, and sputtering target material for use in the method (2012-05-29),

11. 8169079 - Copper interconnection structures and semiconductor devices (2012-05-01),

12. 8164701 - Liquid crystal display device (2012-04-24),

13. 8163649 - Copper interconnection structure, semiconductor device, and method for forming copper interconnection structure (2012-04-24),

14. 8112885 - Method for forming copper interconnection structures (2012-02-14),

15. 8089158 - Liquid crystal display device and manufacturing method therefor (2012-01-03),

Advanced Interconnect Materials, LLC is a leading provider of advanced materials for the electronics industry. With a focus on developing innovative solutions for high-performance interconnects, the company offers a wide range of products including conductive adhesives, thermal interface materials, and specialty films. Advanced Interconnect Materials serves a diverse customer base across various industries, delivering reliable and cutting-edge materials to meet their unique needs.

This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Sep 15 2026

23 Patents

#4 in Miyagi

#2,701 in Japan

#27,581 in the World

Advanced Interconnect Materials, LLC

Forward Citations = 178

6 inventors:

Junichi Koike (23 out of 56 patents)

Hideaki Kawakami (9 out of 37 patents)

Akihiro Shibatomi (9 out of 10 patents)

4. Pilsang Yun (3 out of 3 patents)

5. Mayumi Naito (1 out of 1 patent)

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