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For the Inventor, By the Inventor

Miyagi, Japan

Advanced Interconnect Materials, LLC

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USPTO Granted Patents = 23

% Expired Patents = 52.2


Forward Citations = 178

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6 inventors (with patents filed for the assignee):

goldMedal Junichi Koike (23 out of 56 patents)

silverMedal Hideaki Kawakami (9 out of 37 patents)

bronzeMedal Akihiro Shibatomi (9 out of 10 patents)

4.  Pilsang Yun (3 out of 3 patents)

5.  Mayumi Naito (1 out of 1 patent)

6.  Kouji Neishi (1 out of 1 patent)


23 patents:

1. 9123821 - Electrode for oxide semiconductor, method of forming the same, and oxide semiconductor device provided with the electrode (2015-09-01),
2. 9082821 - Method for forming copper interconnection structures (2015-07-14),
3. 8895978 - Semiconductor device (2014-11-25),
4. 8866140 - Thin-film transistor (2014-10-21),
5. 8531033 - Contact plug structure, semiconductor device, and method for forming contact plug (2013-09-10),
6. 8420535 - Copper interconnection, method for forming copper interconnection structure, and semiconductor device (2013-04-16),
7. 8372745 - Semiconductor device, its manufacturing method, and sputtering target material for use in the method (2013-02-12),
8. 8324730 - Copper interconnection structure and method for forming copper interconnections (2012-12-04),
9. 8258626 - Copper interconnection, method for forming copper interconnection structure, and semiconductor device (2012-09-04),
10. 8188599 - Semiconductor device, its manufacturing method, and sputtering target material for use in the method (2012-05-29),
11. 8169079 - Copper interconnection structures and semiconductor devices (2012-05-01),
12. 8164701 - Liquid crystal display device (2012-04-24),
13. 8163649 - Copper interconnection structure, semiconductor device, and method for forming copper interconnection structure (2012-04-24),
14. 8112885 - Method for forming copper interconnection structures (2012-02-14),
15. 8089158 - Liquid crystal display device and manufacturing method therefor (2012-01-03),
Company Overview
Advanced Interconnect Materials, LLC specializes in the development and manufacturing of advanced materials for semiconductor packaging and interconnect applications. The company focuses on innovative solutions that enhance the performance and reliability of electronic devices. With a strong emphasis on research and technology, it operates within the semiconductor industry, contributing to advancements in materials science and engineering. Headquartered in Miyagi, Japan, it serves a global market, addressing the evolving needs of technology-driven sectors.
Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Oct 27 2026

23 Patents

#4 in Miyagi

#2,708 in Japan

#27,736 in the World

Miyagi, JP
Miyagi, Japan

Advanced Interconnect Materials, LLC

Forward Citations = 178

6 inventors:

goldMedal Junichi Koike (23 out of 56 patents)

silverMedal Hideaki Kawakami (9 out of 37 patents)

bronzeMedal Akihiro Shibatomi (9 out of 10 patents)

4.  Pilsang Yun (3 out of 3 patents)

5.  Mayumi Naito (1 out of 1 patent)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Advanced Interconnect Materials, LLC. Retrieved from https://idiyas.com/company/advanced-interconnect-materials

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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