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Advanced Interconnect Materials, LLC

USPTO Granted Patents = 23

% Expired Patents = 52.2

EPO Patents = 1

Forward Citations = 178

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6 inventors (with patents filed for the assignee):

Junichi Koike (23 out of 56 patents)

Hideaki Kawakami (9 out of 37 patents)

Akihiro Shibatomi (9 out of 10 patents)

4. Pilsang Yun (3 out of 3 patents)

5. Mayumi Naito (1 out of 1 patent)

6. Kouji Neishi (1 out of 1 patent)

23 patents: Sort by Forward Citations

1. 9123821 - Electrode for oxide semiconductor, method of forming the same, and oxide semiconductor device provided with the electrode (2015-09-01),

2. 9082821 - Method for forming copper interconnection structures (2015-07-14),

3. 8895978 - Semiconductor device (2014-11-25),

4. 8866140 - Thin-film transistor (2014-10-21),

5. 8531033 - Contact plug structure, semiconductor device, and method for forming contact plug (2013-09-10),

6. 8420535 - Copper interconnection, method for forming copper interconnection structure, and semiconductor device (2013-04-16),

7. 8372745 - Semiconductor device, its manufacturing method, and sputtering target material for use in the method (2013-02-12),

8. 8324730 - Copper interconnection structure and method for forming copper interconnections (2012-12-04),

9. 8258626 - Copper interconnection, method for forming copper interconnection structure, and semiconductor device (2012-09-04),

10. 8188599 - Semiconductor device, its manufacturing method, and sputtering target material for use in the method (2012-05-29),

11. 8169079 - Copper interconnection structures and semiconductor devices (2012-05-01),

12. 8164701 - Liquid crystal display device (2012-04-24),

13. 8163649 - Copper interconnection structure, semiconductor device, and method for forming copper interconnection structure (2012-04-24),

14. 8112885 - Method for forming copper interconnection structures (2012-02-14),

15. 8089158 - Liquid crystal display device and manufacturing method therefor (2012-01-03),

Advanced Interconnect Materials, LLC specializes in the development and manufacturing of advanced materials for semiconductor packaging and interconnect applications. The company focuses on innovative solutions that enhance the performance and reliability of electronic devices. With a strong emphasis on research and technology, it operates within the semiconductor industry, contributing to advancements in materials science and engineering. Headquartered in Miyagi, Japan, it serves a global market, addressing the evolving needs of technology-driven sectors.

Profile summary based on public USPTO records.

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USPTO Data Jan 1 1976 - Oct 6 2026

23 Patents

#4 in Miyagi

#2,702 in Japan

#27,649 in the World

Advanced Interconnect Materials, LLC

Forward Citations = 178

6 inventors:

Junichi Koike (23 out of 56 patents)

Hideaki Kawakami (9 out of 37 patents)

Akihiro Shibatomi (9 out of 10 patents)

4. Pilsang Yun (3 out of 3 patents)

5. Mayumi Naito (1 out of 1 patent)

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