The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2015

Filed:

Sep. 05, 2013
Applicant:

Advanced Interconnect Materials, Llc, Sendai-shi, Miyagi, JP;

Inventors:

Junichi Koike, Sendai, JP;

Mayumi Naito, Sendai, JP;

Pilsang Yun, Sendai, JP;

Hideaki Kawakami, Chiba, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 29/786 (2006.01); H01L 29/66 (2006.01); H01L 29/45 (2006.01); H01L 33/40 (2010.01); H01L 33/42 (2010.01);
U.S. Cl.
CPC ...
H01L 29/7869 (2013.01); H01L 29/45 (2013.01); H01L 29/66742 (2013.01); H01L 29/78618 (2013.01); H01L 33/40 (2013.01); H01L 33/42 (2013.01); H01L 2933/0016 (2013.01);
Abstract

To make it possible to form a metal electrode of low electrical contact resistance on a conductive indium-containing oxide semiconductor layer constituting a device active layer of a thin-film transistor or the like. Between an indium-containing oxide semiconductor layer and a metal electrode layer provided above this layer for passing device operating current, which can reduce indium oxide or the like of the oxide semiconductor layer. A metallic oxide layer and a metal layer are formed using as material a metal film including an easily oxidable metal, and further an indium-rich layer in which reduced indium is accumulated is formed at a boundary between the metallic oxide layer and the metal layer.


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