Enter assignee name

% Expired Patents = 88.9

Forward Citations = 5

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4 inventors (with patents filed for the assignee):

Lee-Sheng Yen (8 out of 8 patents)

Doau-Tzu Wang (3 out of 3 patents)

Fu-Lung Chen (1 out of 4 patents)

4. Chao-Hui Tseng (1 out of 1 patent)

9 patents: Sort by Forward Citations

1. 9084341 - Fabrication method of packaging substrate (2015-07-14),

2. 8987060 - Method for making circuit board (2015-03-24),

3. 8836108 - Circuit board structure and package structure (2014-09-16),

4. 8748234 - Method for making circuit board (2014-06-10),

5. 8742567 - Circuit board structure and packaging structure comprising the circuit board structure (2014-06-03),

6. 8698008 - Packaging substrate and fabrication method thereof (2014-04-15),

7. 8628636 - Method of manufacturing a package substrate (2014-01-14),

8. 8102063 - Pad structure with a nano-structured coating film (2012-01-24),

9. 6555592 - Photothermosetting composition comprising acrylated epoxy resin (2003-04-29),

Advance Materials Corporation is a leading provider of innovative materials solutions for a wide range of industries. Our products are known for their high quality, durability, and performance. With a strong focus on research and development, we are dedicated to pushing the boundaries of material science to meet the evolving needs of our customers.

Profile summary based on public USPTO records.

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USPTO Data Jan 1 1976 - Oct 6 2026

9 Patents

#149 in Taoyuan

#1,547 in Taiwan

Taoyuan, Taiwan

Advance Materials Corporation

Forward Citations = 5

4 inventors:

Lee-Sheng Yen (8 out of 8 patents)

Doau-Tzu Wang (3 out of 3 patents)

Fu-Lung Chen (1 out of 4 patents)

4. Chao-Hui Tseng (1 out of 1 patent)

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