Enter assignee name

Forward Citations = 5

Loading Chart...

4 inventors (with patents filed for the assignee):

Lee-Sheng Yen (8 out of 8 patents)

Doau-Tzu Wang (3 out of 3 patents)

Fu-Lung Chen (1 out of 4 patents)

4. Chao-Hui Tseng (1 out of 1 patent)

9 patents: Sort by Forward Citations

1. 9084341 - Fabrication method of packaging substrate (2015-07-14),

2. 8987060 - Method for making circuit board (2015-03-24),

3. 8836108 - Circuit board structure and package structure (2014-09-16),

4. 8748234 - Method for making circuit board (2014-06-10),

5. 8742567 - Circuit board structure and packaging structure comprising the circuit board structure (2014-06-03),

6. 8698008 - Packaging substrate and fabrication method thereof (2014-04-15),

7. 8628636 - Method of manufacturing a package substrate (2014-01-14),

8. 8102063 - Pad structure with a nano-structured coating film (2012-01-24),

9. 6555592 - Photothermosetting composition comprising acrylated epoxy resin (2003-04-29),

Advance Materials Corporation is a leading provider of innovative materials solutions for a wide range of industries. Our products are known for their high quality, durability, and performance. With a strong focus on research and development, we are dedicated to pushing the boundaries of material science to meet the evolving needs of our customers.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 23 2025

9 Patents

#1 in Toayuan

#1,483 in Taiwan

Toayuan, Taiwan

Advance Materials Corporation

Forward Citations = 5

4 inventors:

Lee-Sheng Yen (8 out of 8 patents)

Doau-Tzu Wang (3 out of 3 patents)

Fu-Lung Chen (1 out of 4 patents)

4. Chao-Hui Tseng (1 out of 1 patent)

Please report any incorrect information to support@idiyas.com