This inventor holds 8 USPTO granted patents and 5 published patent applications. Top assignee: Advance Materials Corporation. Active years: 2012-2015.
Location History:
- Taoyuan County, TW (2012 - 2015)
- Toayuan, TW (2014 - 2015)
Company Filing History:
Years Active: 2012-2015
Title: Lee-Sheng Yen: Innovator in Packaging Substrate Technology
Introduction
Lee-Sheng Yen is a prominent inventor based in Taoyuan County, Taiwan. He has made significant contributions to the field of packaging substrate technology, holding a total of 8 patents. His innovative approaches have paved the way for advancements in circuit board manufacturing and packaging solutions.
Latest Patents
Among his latest patents is a fabrication method of packaging substrate. This invention provides a packaging substrate that includes a core layer with opposite first and second surfaces, two circuit layers formed on these surfaces, and a plurality of conductive through holes that penetrate the core layer. These holes are electrically connected to the circuit layers, ensuring efficient functionality. Additionally, the design incorporates two insulating protection layers and a carrier attached to one of the layers to prevent cracking during transportation or packaging. Another notable patent is a method for making a circuit board. This method involves using a first substrate with a release film and a second substrate with a copper film covered by a solder mask. The process includes patterning the solder mask, pressing the substrates together, and forming a circuit board structure with a passivation layer.
Career Highlights
Lee-Sheng Yen is currently employed at Advance Materials Corporation, where he continues to innovate and develop new technologies. His work has significantly impacted the industry, particularly in enhancing the reliability and efficiency of packaging substrates.
Collaborations
One of his notable collaborators is Doau-Tzu Wang, with whom he has worked on various projects to advance their shared goals in technology development.
Conclusion
Lee-Sheng Yen's contributions to packaging substrate technology exemplify his dedication to innovation and excellence. His patents reflect a deep understanding of the complexities involved in circuit board manufacturing, making him a valuable asset to the field.