The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2014
Filed:
Jan. 13, 2012
Applicants:
Lee-sheng Yen, Toayuan, TW;
Doau-tzu Wang, Toayuan, TW;
Inventors:
Lee-Sheng Yen, Toayuan, TW;
Doau-Tzu Wang, Toayuan, TW;
Assignee:
Advance Materials Corporation, Toayuan, TW;
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/52 (2006.01); B32B 37/12 (2006.01); B32B 37/14 (2006.01); B32B 37/26 (2006.01); B32B 38/10 (2006.01); B32B 7/06 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of manufacturing a package substrate. A carrier member is formed on an insulation protection layer on either of two surfaces of a core layer. The package substrate has the carrier member combined with one side thereof, and is prevented from being damaged during transportation or packaging due to reduced thickness.