Toayuan, Taiwan

Doau-Tzu Wang

USPTO Granted Patents = 3 

Average Co-Inventor Count = 2.0

ph-index = 1


Location History:

  • Toayuan, TW (2014)
  • Taoyuan, TW (2015)

Company Filing History:


Years Active: 2014-2015

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3 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Doau-Tzu Wang

Introduction

Doau-Tzu Wang is a prominent inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of packaging substrates, holding a total of 3 patents. His work focuses on enhancing the durability and functionality of packaging materials used in various applications.

Latest Patents

Wang's latest patents include a novel fabrication method of packaging substrate. This innovative packaging substrate features a core layer with opposite first and second surfaces, two circuit layers formed on these surfaces, and a series of conductive through holes that penetrate the core layer. These holes are electrically connected to the circuit layers, ensuring efficient functionality. Additionally, the substrate is equipped with two insulating protection layers and a carrier attached to one of the insulating layers, which prevents cracking during transportation or packaging.

Another notable patent by Wang is the packaging substrate and its fabrication method, which shares similar features to his latest innovation. This consistency in design highlights his commitment to improving packaging technology and ensuring the reliability of products during their lifecycle.

Career Highlights

Doau-Tzu Wang is currently employed at Advance Materials Corporation, where he continues to develop cutting-edge solutions in material science. His expertise in packaging substrates has positioned him as a key player in the industry, contributing to advancements that benefit various sectors.

Collaborations

Wang collaborates with Lee-Sheng Yen, a fellow innovator in the field. Together, they work on projects that push the boundaries of material technology and enhance the performance of packaging solutions.

Conclusion

Doau-Tzu Wang's contributions to the field of packaging substrates demonstrate his innovative spirit and dedication to advancing technology. His patents reflect a deep understanding of material science and a commitment to improving product reliability. Wang's work continues to influence the industry, paving the way for future innovations.

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