The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 05, 2018

Filed:

Jul. 25, 2016
Applicants:

Tokyo Electron Limited, Tokyo, JP;

Central Glass Co., Ltd., Yamaguchi, JP;

Inventors:

Jun Lin, Yamanashi, JP;

Koji Takeya, Yamanashi, JP;

Mitsuhiro Tachibana, Yamanashi, JP;

Akifumi Yao, Yamaguchi, JP;

Kunihiro Yamauchi, Yamaguchi, JP;

Tatsuo Miyazaki, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/3213 (2006.01); H01L 21/311 (2006.01); H01L 21/3065 (2006.01); H05K 3/02 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67069 (2013.01); H01L 21/3065 (2013.01); H01L 21/31116 (2013.01); H01L 21/31138 (2013.01); H01L 21/32135 (2013.01); H01L 21/32136 (2013.01); H05K 3/02 (2013.01); H01L 21/32138 (2013.01); H01L 23/53209 (2013.01); H01L 2924/01027 (2013.01); H05K 2203/0315 (2013.01);
Abstract

An etching method includes a step of etching a cobalt film formed on a surface of a target object by supplying an etching gas containing β-diketone and an oxidizing gas for oxidizing the cobalt film to the target object. The supply of the etching gas and the oxidizing gas is carried out such that a flow rate ratio of the oxidizing gas to the etching gas is ranging from 0.5% to 50% while heating the target object to a temperature lower than or equal to 250° C.

Published as:
US2017032990A1; JP2017028198A; KR20170013169A; CN106409656A; TW201716633A; US9991138B2; KR101898329B1; JP6529371B2; CN106409656B; TWI691616B;

Find Patent Forward Citations

Loading…