The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2016
Filed:
Jun. 06, 2014
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Chen-Hua Yu, Hsin-Chu, TW;
Chi-Hsi Wu, Hsin-Chu, TW;
Wen-Chih Chiou, Zhunan Township, TW;
Hsiang-Fan Lee, Hsin-Chu, TW;
Shih-Peng Tai, Xinpu Township, TW;
Tang-Jung Chiu, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A method for forming integrated circuit packages is presented. A first plurality of first tier stacks are mounted to the substrate, wherein the substrate has one or more contact pads corresponding to each of the first tier stacks and has one or more probing pads associated with each of the first tier stacks. Each of the first tier stacks is electrically tested to identify known good first tier stacks and known bad first tier stacks. A first plurality of stacking substrates are mounted to the known good first tier stacks, thereby forming a plurality of second tier stacks. Each of the second tier stacks is electrically tested to identify known good second tier stacks and known bad second tier stacks.