The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2013
Filed:
Nov. 16, 2007
Chung Yu Wang, Hsin Chu, TW;
Chien-hsiun Lee, Hsin Chu, TW;
Pei-haw Tsao, Tai-Chung, TW;
Kuo-chin Chang, Hsin Chu, TW;
Chung-yi Lin, Hsin chu, TW;
Bill Kiang, Hsin chu, TW;
Chung Yu Wang, Hsin Chu, TW;
Chien-Hsiun Lee, Hsin Chu, TW;
Pei-Haw Tsao, Tai-Chung, TW;
Kuo-Chin Chang, Hsin Chu, TW;
Chung-Yi Lin, Hsin chu, TW;
Bill Kiang, Hsin chu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
Protection of a solder ball joint is disclosed in which the solder ball joint is located below the surface level of the encapsulating buffer layer. The buffering layer is etched to expose one or more electrode posts, each of which may be made up of a single column or multiple columns. A top layer resulting either from a top conductive cap or a plating layer around the electrode posts also lies below the buffer layer. When the solder ball is placed onto the posts, the solder/ball joint is protected in a position below the surface of the buffer layer, while still maintaining an electrical connection between the various solder balls and their associated or capping/plating material, electrode posts, wiring layers, and circuit layers. Therefore, the entire ball joint is protected from direct stress.