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Hsinchu, Taiwan

Bill Kiang

USPTO Granted Patents = 6

Average Co-Inventor Count = 5.3

ph-index = 4

Forward Citations = 116(Granted Patents)

Company Filing History:

6 out of 40,635

Taiwan Semiconductor Manufacturing Comp. Ltd.

Years Active: 2010-2015

where 'Filed Patents' based on already Granted Patents

6 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 9136211 - Protected solder ball joints in wafer level chip-scale packaging (2015-09-15),

2. 8492263 - Protected solder ball joints in wafer level chip-scale packaging (2013-07-23),

3. 8217520 - System-in-package packaging for minimizing bond wire contamination and yield loss (2012-07-10),

4. 7719122 - System-in-package packaging for minimizing bond wire contamination and yield loss (2010-05-18),

5. 7679180 - Bond pad design to minimize dielectric cracking (2010-03-16),

6. 7659632 - Solder bump structure and method of manufacturing same (2010-02-09),

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