For the Inventor, By the Inventor

Enter inventor name

Hsinchu, Taiwan

Bill Kiang

This inventor holds 6 USPTO granted patents. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2010-2015.

USPTO Granted Patents = 6

% Patents Active = 50.0

Average Co-Inventor Count = 5.3

ph-index = 4

Forward Citations = 116(Granted Patents)

Company Filing History:

6 out of 42,759

Taiwan Semiconductor Manufacturing Comp. Ltd.

Years Active: 2010-2015

Loading Chart...

6 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9136211 - Protected solder ball joints in wafer level chip-scale packaging (2015-09-15),

2. 8492263 - Protected solder ball joints in wafer level chip-scale packaging (2013-07-23),

3. 8217520 - System-in-package packaging for minimizing bond wire contamination and yield loss (2012-07-10),

4. 7719122 - System-in-package packaging for minimizing bond wire contamination and yield loss (2010-05-18),

5. 7679180 - Bond pad design to minimize dielectric cracking (2010-03-16),

6. 7659632 - Solder bump structure and method of manufacturing same (2010-02-09),

Profile summary based on public USPTO records.

Please report any incorrect information to [email protected]

Loading…