The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 2007
Filed:
Apr. 28, 2004
Hsien-ming Lee, Changhua, TW;
Jing-cheng Lin, Hsinchu, TW;
Shing-chyang Pan, Tainan, TW;
Ming-hsing Tsai, Taipei, TW;
Hung-wen Su, Hsinchu, TW;
Shih-wei Chou, Taipei, TW;
Shau-lin Shue, Hsinchu, TW;
Kuo-wei Cheng, Tainan, TW;
Ting-chu Ko, Taipei, TW;
Hsien-Ming Lee, Changhua, TW;
Jing-Cheng Lin, Hsinchu, TW;
Shing-Chyang Pan, Tainan, TW;
Ming-Hsing Tsai, Taipei, TW;
Hung-Wen Su, Hsinchu, TW;
Shih-Wei Chou, Taipei, TW;
Shau-Lin Shue, Hsinchu, TW;
Kuo-Wei Cheng, Tainan, TW;
Ting-Chu Ko, Taipei, TW;
Taiwan Semiconductor Manfacturing Co. Ltd., Hsin-Chu, TW;
Abstract
A method of electrochemical deposition (ECD) provides a barrier and a seed layer on a substrate. The surfaces of the substrate are pre-treated before a metal layer is electrochemically deposited thereon in an electrochemical plating cell with a physical or a chemical surface treatment process. The electrochemical plating cell is covered by a cap to prevent evaporation of the electrolyte solution. The electrochemical plating cell includes a substrate holder assembly with a lift seal, e.g., with a contact angle θ less than 90° between the lift seal and the substrate. The substrate holder assembly includes a substrate chuck at the rear side of the substrate.