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For the Inventor, By the Inventor

Hsinchu, Taiwan

Ting-Chu Ko

This inventor holds 30 USPTO granted patents and 9 published patent applications, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2006-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ting-Chu Ko. Retrieved from https://idiyas.com/inventor/ting-chu-ko

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 30 

% Patents Active = 76.7

Average Co-Inventor Count = 4.5

ph-index = 4

Forward Citations = 1,395(Granted Patents)


Location History:

  • Taipei, TW (2006 - 2014)
  • Hsin-Chu, TW (2007 - 2024)

Company Filing History:

goldMedal28 out of 42,810 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal2 out of 465 
 
Taiwan Semiconductor Manufacturing Co., Ltd.
 patents

Years Active: 2006-2026

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Areas of Expertise:
3DIC Package
Semiconductor Device
Memory Device
Integrated Fan-Out
Thermal Management
High Performance Interconnect
Copper Interconnects
CMP Processes
Electro Chemical Plating
Damascene Structure
FinFET Design
30 patents (USPTO):Explore Patents
1. 12708039 - Method of manufacturing 3DIC package comprising a plurality of discrete device dies bonding to a wafer (2026-08-11),
2. 12616017 - Semiconductor device and method (2026-04-28),
3. 12533766 - Simplified carrier removable by reduced number of CMP processes (2026-01-27),
4. 12400936 - Stacked memory cube with integrated thermal path for enhanced heat dissipation (2025-08-26),
5. 12205888 - Semiconductor packages and methods of forming the same (2025-01-21),
6. 12165985 - Semiconductor device and method (2024-12-10),
7. 12148735 - Memory device and manufacturing method thereof (2024-11-19),
8. 11929319 - Integrated fan-out packages and methods of forming the same (2024-03-12),
9. 11551999 - Memory device and manufacturing method thereof (2023-01-10),
10. 11488908 - Semiconductor device and method (2022-11-01),
11. 11335666 - Memory device and manufacturing method thereof (2022-05-17),
12. 11127708 - Package structure and method of manufacturing the same (2021-09-21),
13. 11075159 - Integrated fan-out packages and methods of forming the same (2021-07-27),
14. 10879170 - Semiconductor package and manufacturing method thereof (2020-12-29),
15. 10629540 - Semiconductor device and method (2020-04-21),

Title: The Innovative Journey of Ting-Chu Ko

Introduction: Ting-Chu Ko, a distinguished inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Ting-Chu Ko's latest patents include advancements in semiconductor technology, renewable energy solutions, and artificial intelligence systems, showcasing his versatility and forward-thinking approach to innovation.

Career Highlights: With a career spanning over two decades, Ting-Chu Ko has worked with leading tech companies and research institutions, spearheading projects that have revolutionized various industries. His keen eye for detail and passion for problem-solving have led to the successful development of cutting-edge technologies.

Collaborations: Throughout his career, Ting-Chu Ko has collaborated with top engineers, scientists, and researchers from around the world, fostering a culture of innovation and knowledge-sharing. His collaborative efforts have resulted in the creation of groundbreaking inventions that have had a lasting impact on society.

Conclusion: Ting-Chu Ko's relentless pursuit of innovation and his dedication to pushing the boundaries of technology have solidified his reputation as a visionary inventor. His contributions to the field continue to inspire future generations of inventors and shape the landscape of technological advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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