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Ting-Chu Ko

This inventor holds 30 USPTO granted patents and 9 published patent applications, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2006-2026.

USPTO Granted Patents = 30 (Patent Applications = 9)

% Patents Active = 76.7

Average Co-Inventor Count = 4.5

ph-index = 4

Forward Citations = 1,395(Granted Patents)

Location History:

Taipei, TW (2006 - 2014)
Hsin-Chu, TW (2007 - 2024)

Company Filing History:

28 out of 42,810

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

2 out of 465

Taiwan Semiconductor Manufacturing Co., Ltd.

patents

Years Active: 2006-2026

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Areas of Expertise:

3DIC Package

Semiconductor Device

Memory Device

Integrated Fan-Out

Thermal Management

High Performance Interconnect

Copper Interconnects

CMP Processes

Electro Chemical Plating

Damascene Structure

FinFET Design

30 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12708039 - Method of manufacturing 3DIC package comprising a plurality of discrete device dies bonding to a wafer (2026-08-11),

2. 12616017 - Semiconductor device and method (2026-04-28),

3. 12533766 - Simplified carrier removable by reduced number of CMP processes (2026-01-27),

4. 12400936 - Stacked memory cube with integrated thermal path for enhanced heat dissipation (2025-08-26),

5. 12205888 - Semiconductor packages and methods of forming the same (2025-01-21),

6. 12165985 - Semiconductor device and method (2024-12-10),

7. 12148735 - Memory device and manufacturing method thereof (2024-11-19),

8. 11929319 - Integrated fan-out packages and methods of forming the same (2024-03-12),

9. 11551999 - Memory device and manufacturing method thereof (2023-01-10),

10. 11488908 - Semiconductor device and method (2022-11-01),

11. 11335666 - Memory device and manufacturing method thereof (2022-05-17),

12. 11127708 - Package structure and method of manufacturing the same (2021-09-21),

13. 11075159 - Integrated fan-out packages and methods of forming the same (2021-07-27),

14. 10879170 - Semiconductor package and manufacturing method thereof (2020-12-29),

15. 10629540 - Semiconductor device and method (2020-04-21),

Title: The Innovative Journey of Ting-Chu Ko

Introduction: Ting-Chu Ko, a distinguished inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Ting-Chu Ko's latest patents include advancements in semiconductor technology, renewable energy solutions, and artificial intelligence systems, showcasing his versatility and forward-thinking approach to innovation.

Career Highlights: With a career spanning over two decades, Ting-Chu Ko has worked with leading tech companies and research institutions, spearheading projects that have revolutionized various industries. His keen eye for detail and passion for problem-solving have led to the successful development of cutting-edge technologies.

Collaborations: Throughout his career, Ting-Chu Ko has collaborated with top engineers, scientists, and researchers from around the world, fostering a culture of innovation and knowledge-sharing. His collaborative efforts have resulted in the creation of groundbreaking inventions that have had a lasting impact on society.

Conclusion: Ting-Chu Ko's relentless pursuit of innovation and his dedication to pushing the boundaries of technology have solidified his reputation as a visionary inventor. His contributions to the field continue to inspire future generations of inventors and shape the landscape of technological advancements.

Profile summary based on public USPTO records.

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