The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2003
Filed:
Sep. 10, 1998
Fumio Mizuno, Tokorozawa, JP;
Seiji Isogai, Hitachinaka, JP;
Kenji Watanabe, Oume, JP;
Yasuhiro Yoshitake, Yokosuka, JP;
Terushige Asakawa, Hamura, JP;
Yuichi Ohyama, Isezaki, JP;
Hidekuni Sugimoto, Honjyo, JP;
Seiji Ishikawa, Kawasaki, JP;
Masataka Shiba, Yokohama, JP;
Jun Nakazato, Shinagawa-ku, JP;
Makoto Ariga, Yokohama, JP;
Tetsuji Yokouchi, Yokohama, JP;
Toshimitsu Hamada, Yokohama, JP;
Ikuo Suzuki, Hitachinaka, JP;
Masami Ikota, Higashiyamato, JP;
Mari Nozoe, Oume, JP;
Isao Miyazaki, Isezaki, JP;
Yoshiharu Shigyo, Takasaki, JP;
Other;
Abstract
A process management system in accordance with the present invention includes inspection apparatuses for inspecting defects on a wafer, the inspection apparatuses being connected through a communication network, inspection information and image information obtained from these inspection apparatuses being collected to construct a data base and an image file, therein definition of defects is given by combinations of elements which characterize the defect based on the inspection information and the image information obtained from the inspection apparatuses. By giving definition of the defect, characteristics of the defect can be subdivided and known. Therefore, the cause of a defect can be studied.