The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2000
Filed:
Aug. 05, 1996
Mitsuhiro Nanbu, Kumamoto-ken, JP;
Naruaki Iida, Kumamoto, JP;
Hideaki Gotou, Kumamoto-ken, JP;
Masanori Tateyama, Kumamoto, JP;
Yuji Yoshimoto, Kumamoto-ken, JP;
Tomoko Ishimoto, Kumamoto, JP;
Hidetami Yaegashi, Tokyo, JP;
Yasunori Kawakami, Kikuchi, JP;
Takahide Fukuda, Kumamoto, JP;
Akihiro Fujimoto, Kumamoto-ken, JP;
Takashi Takekuma, Yamaga, JP;
Hiroyuki Matsukawa, Kumamoto, JP;
Tokyo Electron Limited, Tokyo, JP;
Tokyo Electron Kyushu Limited, Tosu, JP;
Abstract
A method of subjecting a plurality of wafers to coating and beating treatments where a first boat is placed on a stage arranged in an interface section. The first boat is capable of containing the wafers stacked at intervals in a vertical direction. The stage is capable of moving in a horizontal direction, and has a plurality of positions for respectively placing a plurality of boats. The wafers are conveyed from a supply section to a coating section, and are subjected to a coating treatment one by one. The wafers, which have undergone the coating treatment, are conveyed to the interface section. The wafers, which have undergone the coating treatment, are loaded into the first boat placed on the stage, in the interface section. The first boat containing the wafers, which have undergone the coating treatment, is located at a transfer position by moving the stage. The first boat, located at a transfer position by moving the stage. The first boat, located at the transfer position, is conveyed from the stage into a heating section, and the wafers, which have undergone the coating treatment, are subjected to a heating treatment simultaneously and all together.