The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 17, 2025

Filed:

Apr. 11, 2022
Applicant:

Samtec, Inc., New Albany, IN (US);

Inventors:

Christopher David Bohn, New Albany, IN (US);

Mark Crain, New Albany, IN (US);

Justin Roehm, New Albany, IN (US);

Thomas Jacob Hammann, Arvada, CO (US);

Nathan Robertson, New Albany, IN (US);

Jeremy Brown, New Albany, IN (US);

Christopher Pelkey, New Albany, IN (US);

Adam Owens, New Albany, IN (US);

Russell Payton, New Albany, IN (US);

Russell Frank, New Albany, IN (US);

Assignee:

SAMTEC, INC., New Albany, IN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H05K 1/11 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0094 (2013.01); H01L 21/486 (2013.01); H01L 23/49827 (2013.01); H05K 1/115 (2013.01); H05K 3/426 (2013.01); H05K 2203/128 (2013.01); Y10T 29/49993 (2015.01);
Abstract

A substrate includes a substrate body made of a material such as glass, and at least one electrical via that extends at least into or through the substrate body. The via is metalized with a molten metal that enters the via under capillary action and solidifies to establish electrical conductivity through the via. The melting temperature of the metal is less than the transition temperature and melting temperature of the substrate body.


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