Thomas Jacob Hammann

Title: Thomas Jacob Hammann: Innovator in Electrical Conductivity

Introduction

Thomas Jacob Hammann is a notable inventor based in Arvada, CO (US). He has made significant contributions to the field of electrical engineering, particularly in the development of innovative methods for creating electrically conductive vias in substrates.

Latest Patents

Hammann holds 2 patents that showcase his expertise and innovative thinking. His latest patents include "High aspect ratio vias filled with liquid metal fill," which describes a substrate made of materials such as glass, featuring at least one electrical via. This via is metalized with molten metal that enters under capillary action, solidifying to establish electrical conductivity. The melting temperature of the metal is designed to be lower than the transition and melting temperatures of the substrate body. Another significant patent is "Electrically conductive vias and methods for producing same," which details a process for metallizing holes in a glass substrate. This method involves forcing a suspension of electrically conductive particles through the holes, utilizing various forces such as air pressure differentials or centrifugal force.

Career Highlights

Hammann is currently employed at Samtec Incorporated, where he continues to push the boundaries of electrical component design. His work has been instrumental in advancing technologies that enhance electrical conductivity in various applications.

Collaborations

Throughout his career, Hammann has collaborated with talented individuals such as Christopher David Bohn and Mark Crain. These partnerships have contributed to the successful development of his innovative patents.

Conclusion

Thomas Jacob Hammann is a distinguished inventor whose work in electrical conductivity has led to groundbreaking patents. His contributions continue to influence the field and inspire future innovations.