Samtec Incorporated

Thomas Jacob Hammann

Daniel Long

Alan D Nolet

Andrew Haynes Liotta

Ajeet Kumar

Vishwas Vinayak Hardikar

Daniel Goia

Justin Roehm

Adam Owens

Christopher David Bohn

Troy Benton Holland

Jeremy Brown

Mark Crain

Lauren Savawn Moen

Christopher Pelkey

Heidi Bates

Nathan Robertson

Russell Payton

Nicole Mcgraw

Russell Frank

A substrate includes a substrate body made of a material such as glass, and at least one electrical via that extends at least into or through the substrate body. The via is metalized with a molten metal that enters the via under capillary action and solidifies to establish electrical conductivity through the via. The melting temperature of the metal is less than the transition temperature and melting temperature of the substrate body.

High aspect ratio vias filled with liquid metal fill

An electrical component is provided by metallizing holes that extend through a glass substrate. The electrical component can be fabricated by forcing a suspension of electrically conductive particles suspended in a liquid medium through the holes. The suspension can be forced into the holes under an air pressure differential such as a pressure differential force, a centrifugal force, or an electrostatic force. The liquid medium in the holes can be dried, and the particles can be sintered. The particles can further be packed in the hole. Alternatively or additionally, the particles can be pressed against the outer surfaces of the substrate to produce buttons.

Electrically conductive vias and methods for producing same

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Arvada, CO, United States of America

Thomas Jacob Hammann