Justin Roehm

Title: The Innovative Contributions of Justin Roehm

Introduction

Justin Roehm is an accomplished inventor based in New Albany, Indiana. He has made significant strides in the field of electrical engineering, particularly with his innovative patent that addresses the challenges of electrical conductivity in substrates.

Latest Patents

Justin holds a patent for "High aspect ratio vias filled with liquid metal fill." This invention involves a substrate made of materials such as glass, featuring at least one electrical via that extends into or through the substrate body. The via is metalized with a molten metal that enters under capillary action and solidifies, establishing electrical conductivity. Notably, the melting temperature of the metal is lower than the transition and melting temperatures of the substrate body, making this invention particularly valuable in various applications.

Career Highlights

Justin is currently employed at Samtec Incorporated, where he continues to contribute to advancements in electrical engineering. His work focuses on innovative solutions that enhance the performance and reliability of electronic components.

Collaborations

Justin collaborates with talented professionals in his field, including Christopher David Bohn and Mark Crain. Their combined expertise fosters a creative environment that drives innovation at Samtec Incorporated.

Conclusion

Justin Roehm's contributions to the field of electrical engineering, particularly through his patent on high aspect ratio vias, demonstrate his commitment to innovation and excellence. His work continues to influence the industry and pave the way for future advancements.