Jeremy Brown

Title: The Innovative Contributions of Jeremy Brown

Introduction

Jeremy Brown is an accomplished inventor based in New Albany, IN (US). He holds a patent for a groundbreaking technology that enhances electrical conductivity in substrates. His work is significant in the field of electronics, particularly in improving the efficiency of electrical connections.

Latest Patents

Jeremy Brown's notable patent is titled "High aspect ratio vias filled with liquid metal fill." This invention involves a substrate made of materials such as glass, featuring at least one electrical via that extends into or through the substrate body. The via is metalized with a molten metal that enters under capillary action and solidifies, establishing electrical conductivity. Importantly, the melting temperature of the metal is lower than the transition and melting temperatures of the substrate body. This innovation represents a significant advancement in substrate technology.

Career Highlights

Jeremy is currently employed at Samtec Incorporated, where he applies his expertise in electronics and materials science. His role at the company allows him to contribute to the development of cutting-edge technologies that impact various industries.

Collaborations

Throughout his career, Jeremy has collaborated with talented individuals such as Christopher David Bohn and Mark Crain. These partnerships have fostered an environment of innovation and creativity, leading to advancements in their respective fields.

Conclusion

In summary, Jeremy Brown is a notable inventor whose work in substrate technology has the potential to revolutionize electrical connections. His patent and contributions at Samtec Incorporated highlight his commitment to innovation and excellence in the field.