Christopher David Bohn

Title: Christopher David Bohn: Innovator in Liquid Metal Technology

Introduction

Christopher David Bohn is an accomplished inventor based in New Albany, IN (US). He has made significant contributions to the field of electrical engineering, particularly in the area of substrate technology. His innovative approach has led to the development of a unique patent that enhances electrical conductivity in substrates.

Latest Patents

Bohn holds a patent for "High aspect ratio vias filled with liquid metal fill." This invention involves a substrate made of materials such as glass, featuring at least one electrical via that extends into or through the substrate body. The via is metalized with a molten metal that enters under capillary action and solidifies, establishing electrical conductivity. Notably, the melting temperature of the metal is lower than the transition and melting temperatures of the substrate body, making this technology particularly advantageous.

Career Highlights

Christopher Bohn is currently employed at Samtec Incorporated, where he continues to push the boundaries of innovation in electrical engineering. His work has garnered attention for its practical applications and potential to revolutionize substrate technology.

Collaborations

Bohn collaborates with talented individuals such as Mark Crain and Justin Roehm, who contribute to the innovative environment at Samtec Incorporated. Their combined expertise fosters a culture of creativity and advancement in technology.

Conclusion

Christopher David Bohn is a notable inventor whose work in liquid metal technology is paving the way for advancements in electrical substrates. His patent reflects a significant step forward in the field, showcasing his dedication to innovation and engineering excellence.