Russell Frank

Title: The Innovative Contributions of Russell Frank

Introduction

Russell Frank is an accomplished inventor based in New Albany, IN (US). He has made significant contributions to the field of electrical engineering, particularly in the development of advanced substrate technologies. His innovative work has led to the creation of a unique patent that enhances electrical conductivity in substrates.

Latest Patents

Russell Frank holds a patent for "High aspect ratio vias filled with liquid metal fill." This invention involves a substrate that includes a substrate body made of materials such as glass, with at least one electrical via extending into or through the substrate body. The via is metalized with a molten metal that enters the via under capillary action and solidifies, establishing electrical conductivity. Notably, the melting temperature of the metal is lower than both the transition and melting temperatures of the substrate body, making this technology particularly advantageous.

Career Highlights

Russell Frank is currently employed at Samtec Incorporated, where he continues to push the boundaries of innovation in electrical engineering. His work at Samtec has allowed him to collaborate with other talented professionals in the field, further enhancing the impact of his inventions.

Collaborations

Some of Russell's notable coworkers include Christopher David Bohn and Mark Crain. Their collaborative efforts contribute to the innovative environment at Samtec Incorporated, fostering advancements in technology.

Conclusion

Russell Frank's contributions to the field of electrical engineering, particularly through his patent on high aspect ratio vias, demonstrate his commitment to innovation. His work not only enhances electrical conductivity but also showcases the potential for future advancements in substrate technology.