Adam Owens

Title: Adam Owens: Innovator in Electrical Conductivity

Introduction

Adam Owens is an accomplished inventor based in New Albany, IN (US). He has made significant contributions to the field of electrical engineering, particularly in the area of substrate technology. His innovative approach has led to the development of a unique patent that enhances electrical conductivity through advanced materials.

Latest Patents

Owens holds a patent for "High aspect ratio vias filled with liquid metal fill." This invention involves a substrate made of materials such as glass, featuring at least one electrical via that extends into or through the substrate body. The via is metalized with a molten metal that enters under capillary action and solidifies, establishing electrical conductivity. Notably, the melting temperature of the metal is lower than the transition and melting temperatures of the substrate body, making this technology particularly effective.

Career Highlights

Adam Owens is currently employed at Samtec Incorporated, where he continues to innovate and develop new technologies. His work focuses on improving electrical connections and enhancing the performance of electronic devices. With a patent portfolio that includes 1 patent, Owens is recognized for his contributions to the industry.

Collaborations

Throughout his career, Owens has collaborated with talented individuals such as Christopher David Bohn and Mark Crain. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Adam Owens is a notable inventor whose work in electrical conductivity has the potential to impact various technological applications. His patent for high aspect ratio vias filled with liquid metal fill exemplifies his commitment to advancing the field of electrical engineering.