Mark Crain

Title: Mark Crain: Innovator in Electrical Conductivity

Introduction

Mark Crain is an accomplished inventor based in New Albany, IN (US). He has made significant contributions to the field of electrical engineering, particularly in the area of substrate technology. His innovative approach has led to the development of a unique patent that enhances electrical conductivity in substrates.

Latest Patents

Mark Crain holds a patent for "High aspect ratio vias filled with liquid metal fill." This invention involves a substrate body made of materials such as glass, which includes at least one electrical via extending into or through the substrate body. The via is metalized with a molten metal that enters the via under capillary action and solidifies, establishing electrical conductivity. Notably, the melting temperature of the metal is lower than both the transition and melting temperatures of the substrate body, making this technology particularly advantageous.

Career Highlights

Mark Crain is currently employed at Samtec Incorporated, where he continues to innovate and develop new technologies. His work has positioned him as a key player in the advancement of electrical substrate technology. With a total of 1 patent, he has demonstrated his ability to create impactful solutions in his field.

Collaborations

Throughout his career, Mark has collaborated with talented individuals such as Christopher David Bohn and Justin Roehm. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Mark Crain's contributions to electrical engineering through his innovative patent exemplify his commitment to advancing technology. His work at Samtec Incorporated and collaborations with fellow inventors highlight his role as a significant figure in the industry.