The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2025
Filed:
May. 19, 2022
Package assembly including lid with additional stress mitigating feet and methods of making the same
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Yu-Sheng Lin, Zhubei, TW;
Shu-Shen Yeh, Taoyuan, TW;
Chin-Hua Wang, New Taipei, TW;
Po-Yao Lin, Zhudong Township, TW;
Shin-Puu Jeng, Hsinchu, TW;
Chien Hung Chen, Taipei, TW;
Chia-Kuei Hsu, Hsinchu, TW;
Po-Chen Lai, Hsinchu, TW;
Yu Chen Lee, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Abstract
A package assembly includes a package substrate, a package lid located on the package substrate and including a plate portion, an outer foot extending from the plate portion, and an inner foot having a height greater than or equal to a height of the outer foot, extending from the plate portion and including a first inner foot corner portion located inside a first corner of the outer foot, and an adhesive that adheres the outer foot to the package substrate and adheres the inner foot to the package substrate.