Taipei, Taiwan

Chien Hung Chen

Average Co-Inventor Count = 2.0

ph-index = 1


Years Active: 2019-2025

where 'Filed Patents' based on already Granted Patents

5 patents (USPTO):

Title: The Innovative Contributions of Chien Hung Chen

Introduction

Chien Hung Chen, a distinguished inventor based in Taipei, Taiwan, holds a remarkable portfolio of 5 patents. His work primarily focuses on the advancement of packaging and semiconductor technologies, demonstrating his commitment to innovation in these fields.

Latest Patents

Chen's latest inventions include:

1. **Package Assembly Including Lid with Additional Stress Mitigating Feet and Methods of Making the Same**: This patent features a unique package assembly that integrates a package substrate and a specially designed package lid. The lid comprises a plate portion along with both outer and inner feet, specifically engineered to enhance durability and stability.

2. **Semiconductor Package with Riveting Structure Between Two Rings and Method for Forming the Same**: This patent outlines a cutting-edge semiconductor package design. It features a substrate with a semiconductor device mounted on it, utilizing a distinctive ring structure that ensures a secure connection through specially formed protruding and recessed parts.

Career Highlights

Chien Hung Chen has made significant contributions during his tenure at prominent companies such as Taiwan Semiconductor Manufacturing Company Ltd. and Oath Inc. His roles in these organizations have allowed him to drive innovation and development within the semiconductor and technology sectors.

Collaborations

Throughout his career, Chen has collaborated with talented individuals, including Shu-Shen Yeh and Po-Chen Lai. These partnerships have fostered an environment of innovation and creativity, further enhancing the quality of his patented inventions.

Conclusion

Chien Hung Chen's contributions to technology and engineering are marked by his inventive spirit and his ability to solve complex problems through innovative designs. His patents reflect a deep understanding of both packaging and semiconductor technologies, highlighting his status as a significant figure in the field of invention.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…