The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2024
Filed:
Feb. 27, 2023
Kla Corporation, Milpitas, CA (US);
Amnon Manassen, Haifa, IL;
Andrew V. Hill, Sunriver, OR (US);
Yonatan Vaknin, Yoqneam Llit, IL;
Yossi Simon, Qiryat Atta, IL;
Daria Negri, Nesher, IL;
Vladimir Levinski, Migdal HaEmek, IL;
Yuri Paskover, Binyamina, IL;
Anna Golotsvan, Qiryat Tivon, IL;
Nachshon Rothman, DN Oshrat, IL;
Nireekshan K. Reddy, Tel Aviv, IL;
Nir BenDavid, Migdal Ha'emek, IL;
Avi Abramov, Haifa, IL;
Dror Yaacov, Migdal Ha'emek, IL;
Yoram Uziel, Migdal Ha'emek, IL;
Nadav Gutman, Zichron Ya'aqov, IL;
KLA Corporation, Milpitas, CA (US);
Abstract
A method includes generating a sequence of images of a semiconductor wafer from first and second detectors. The first detector images the wafer with first imaging parameters and the second detector images the wafer with second imaging parameters. The first or second imaging parameters are varied across the sequence of images to provide variation at sites across the wafer. The method includes providing a metric indicative of center-of-symmetry variations of first and second target features as a function of the varied imaging parameters based on the sequence of images. The method includes identifying a landscape of values of the varied image parameters for which the metric are below a predefined limit. The method includes generating a recipe for metrology measurements in which the varied imaging parameters are set to values within the landscape. The method includes generating metrology measurements from a production wafer based on the recipe.