The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2022

Filed:

Dec. 28, 2016
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Justin Brockman, Portland, OR (US);

Christopher Wiegand, Portland, OR (US);

MD Tofizur Rahman, Portland, OR (US);

Daniel Ouelette, Portland, OR (US);

Angeline Smith, Hillsboro, OR (US);

Juan Alzate Vinasco, Portland, OR (US);

Charles Kuo, Hillsboro, OR (US);

Mark Doczy, Portland, OR (US);

Kaan Oguz, Beaverton, OR (US);

Kevin O'Brien, Portland, OR (US);

Brian Doyle, Portland, OR (US);

Oleg Golonzka, Beaverton, OR (US);

Tahir Ghani, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 43/02 (2006.01); G11C 11/16 (2006.01); H01F 10/32 (2006.01); H01F 41/30 (2006.01); H01L 43/12 (2006.01); H01L 43/08 (2006.01); H01L 27/22 (2006.01); H01L 43/10 (2006.01);
U.S. Cl.
CPC ...
H01L 43/02 (2013.01); G11C 11/161 (2013.01); H01F 10/329 (2013.01); H01F 10/3286 (2013.01); H01F 41/302 (2013.01); H01L 43/08 (2013.01); H01L 43/12 (2013.01); H01L 27/228 (2013.01); H01L 43/10 (2013.01);
Abstract

An apparatus comprises a magnetic tunnel junction (MTJ) including a free magnetic layer, a fixed magnetic layer, and a tunnel barrier between the free and fixed layers, the tunnel barrier directly contacting a first side of the free layer, a capping layer contacting the second side of the free magnetic layer and boron absorption layer positioned a fixed distance above the capping layer.


Find Patent Forward Citations

Loading…