The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 25, 2022

Filed:

Nov. 06, 2017
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Benjamin Chu-Kung, Portland, OR (US);

Jack T. Kavalieros, Portland, OR (US);

Seung Hoon Sung, Portland, OR (US);

Siddharth Chouksey, Portland, OR (US);

Harold W. Kennel, Portland, OR (US);

Dipanjan Basu, Hillsboro, OR (US);

Ashish Agrawal, Hillsboro, OR (US);

Glenn A. Glass, Portland, OR (US);

Tahir Ghani, Portland, OR (US);

Anand S. Murthy, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 29/78 (2006.01); H01L 21/02 (2006.01); H01L 29/08 (2006.01); H01L 29/165 (2006.01); H01L 29/205 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7848 (2013.01); H01L 21/02532 (2013.01); H01L 21/02546 (2013.01); H01L 29/0847 (2013.01); H01L 29/165 (2013.01); H01L 29/205 (2013.01); H01L 29/66522 (2013.01); H01L 29/66545 (2013.01); H01L 29/66636 (2013.01);
Abstract

Integrated circuit transistor structures are disclosed that reduce band-to-band tunneling between the channel region and the source/drain region of the transistor, without adversely increasing the extrinsic resistance of the device. In an example embodiment, the structure includes one or more spacer configured to separate the source and/or drain from the channel region. The spacer(s) regions comprise a semiconductor material that provides a relatively high conduction band offset (CBO) and a relatively low valence band offset (VBO) for PMOS devices, and a relatively high VBO and a relatively low CBO for NMOS devices. In some cases, the spacer includes silicon, germanium, and carbon (e.g., for devices having germanium channel). The proportions may be at least 10% silicon by atomic percentage, at least 85% germanium by atomic percentage, and at least 1% carbon by atomic percentage. Other embodiments are implemented with III-V materials.


Find Patent Forward Citations

Loading…