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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11084072 B1

PDFFull Text
Date of Patent:
Aug. 10, 2021

Filed:

Jan. 15, 2018

Substrate processing apparatus, substrate processing method and recording medium

Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Shogo Fukui, Koshi, JP;

Noritaka Uchida, Koshi, JP;

Takanori Obaru, Koshi, JP;

Hidetaka Shinohara, Koshi, JP;

Shuuichi Nishikido, Koshi, JP;

Tomohito Ura, Koshi, JP;

Yuya Motoyama, Koshi, JP;

Assignee:

TOKYO ELECTRON LIMITED, Tokyo, JP;

Attorney:

Pearne & Gordon LLP

Primary Examiner:

David G Cormier

Assistant Examiner:

Thomas Bucci

Int. Cl.
CPC ...
B08B 17/02 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); H01L 21/02 (2006.01); B08B 1/00 (2006.01); B08B 1/02 (2006.01); B08B 3/04 (2006.01); B08B 5/02 (2006.01); B08B 7/04 (2006.01); F26B 21/14 (2006.01); F26B 3/04 (2006.01); F26B 5/08 (2006.01); B08B 3/08 (2006.01);
U.S. Cl.
CPC ...
B08B 17/025 (2013.01); B08B 1/002 (2013.01); B08B 1/02 (2013.01); B08B 3/041 (2013.01); B08B 5/023 (2013.01); B08B 7/04 (2013.01); F26B 3/04 (2013.01); F26B 21/14 (2013.01); H01L 21/02043 (2013.01); H01L 21/02052 (2013.01); H01L 21/02096 (2013.01); H01L 21/67017 (2013.01); H01L 21/67046 (2013.01); H01L 21/67051 (2013.01); H01L 21/67173 (2013.01); H01L 21/67253 (2013.01); H01L 21/68728 (2013.01); H01L 21/68735 (2013.01); H01L 21/68764 (2013.01); H01L 21/68785 (2013.01); H01L 21/68792 (2013.01); B08B 3/08 (2013.01); F26B 5/08 (2013.01);
Abstract

Contamination of a bottom surface of a substrate caused by a processing liquid used for cleaning a top surface of the substrate can be suppressed. After performing a liquid processing on the top surface of the substrate and a liquid processing on the bottom surface of the substrate in parallel while rotating the substrate by a substrate holding/rotating unit, when stopping the liquid processing on the top surface of the substrate and the liquid processing on the bottom surface of the substrate, a control unitstops a supply of the processing liquid onto the top surface of the substrate by a first processing liquid supply device, and then, stops a supply of the processing liquid onto the bottom surface of the substrate by a second processing liquid supply device

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