The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2020

Filed:

Feb. 22, 2019
Applicant:

Kla-tencor Corporation, Milpitas, CA (US);

Inventors:

Aaron J. Rosenberg, Mountain View, CA (US);

Jonathan Iloreta, Menlo Park, CA (US);

Thaddeus G. Dziura, San Jose, CA (US);

Antonio Gellineau, Santa Clara, CA (US);

Yin Xu, Shanghai, CN;

Kaiwen Xu, Shanghai, CN;

John Hench, Los Gatos, CA (US);

Abhi Gunde, Fremont, CA (US);

Andrei Veldman, Sunnyvale, CA (US);

Liequan Lee, Fremont, CA (US);

Houssam Chouaib, San Jose, CA (US);

Assignee:

KLA Corporation, Milpitas, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/00 (2006.01); G01N 21/95 (2006.01); H01L 27/02 (2006.01); H01L 27/088 (2006.01); H01L 27/108 (2006.01); G06T 17/10 (2006.01); G06T 15/20 (2011.01); G01N 21/956 (2006.01); H01L 27/115 (2017.01); G06F 30/39 (2020.01);
U.S. Cl.
CPC ...
G01N 21/9501 (2013.01); G01N 21/95607 (2013.01); G06F 30/39 (2020.01); G06T 15/205 (2013.01); G06T 17/10 (2013.01); H01L 27/0207 (2013.01); H01L 27/0886 (2013.01); H01L 27/108 (2013.01); H01L 27/115 (2013.01); G06T 2207/20081 (2013.01); G06T 2207/30148 (2013.01);
Abstract

A semiconductor metrology tool inspects an area of a semiconductor wafer. The inspected area includes a plurality of instances of a 3D semiconductor structure arranged periodically in at least one dimension. A computer system generates a model of a respective instance of the 3D semiconductor structure based on measurements collected during the inspection. The computer system renders an image of the model that shows a 3D shape of the model and provides the image to a device for display.


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