Gilbert, AZ, United States of America

Zhihua Zou

This inventor holds 5 USPTO granted patents and 2 published patent applications. Top assignee: Intel Corporation. Active years: 2013-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Zhihua Zou. Retrieved from https://idiyas.com/inventor/zhihua-zou

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 5 

% Patents Active = 40.0

Average Co-Inventor Count = 3.2

ph-index = 1

Forward Citations = 2(Granted Patents)


Location History:

  • Chandler, AZ (US) (2013)
  • Gilbert, AZ (US) (2016 - 2019)

Company Filing History:


Years Active: 2013-2026

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5 patents (USPTO):Explore Patents

Title: Innovations by Zhihua Zou

Introduction

Zhihua Zou is an accomplished inventor based in Gilbert, AZ (US). He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on systems and processes that enhance the measurement and inspection of semiconductor substrates.

Latest Patents

Zhihua Zou's latest patents include innovative systems for measuring thickness values of semiconductor substrates. This system involves a substrate that is vacuumed to a pedestal, which defines a reference plane for accurate measurement. A measurement probe assembly is utilized to determine the substrate's critical thickness variation (CTV) and bowing thickness variation (BTV) values, while also defining the substrate slope angle. Additionally, a thermal bonding assembly is employed to attach a die to the substrate at a bonding angle that is congruent with the substrate slope angle. This method allows for the measurement of multiple substrates using the same reference plane on the pedestal.

Another notable patent involves the inspection of microelectronic devices using near-infrared light. In this process, a dielectric material layer on a substrate is illuminated with a near-infrared light beam. The substrate features at least one contact land, with the dielectric material layer overlying a portion of this contact land. The substrate also includes at least one via defined in the dielectric material layer, which exposes a portion of the contact land. Reflected near-infrared light is captured by a camera, allowing for the determination of the via's position relative to the contact land through an image processing device.

Career Highlights

Zhihua Zou is currently employed at Intel Corporation, where he continues to innovate in the semiconductor industry. His work has been instrumental in advancing the technology used in microelectronic devices.

Collaborations

Zhihua Zou collaborates with talented individuals such as Liang Zhang and Osborne A Martin, III. Their combined expertise contributes to the success of their projects and innovations.

Conclusion

Zhihua Zou's contributions to semiconductor technology through his patents and work at Intel Corporation highlight his role as a leading inventor in the field. His innovative approaches to measuring and inspecting semiconductor substrates are paving the way for advancements in microelectronics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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