The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Apr. 03, 2023
Intel Corporation, Santa Clara, CA (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Disclosed herein are microelectronic assemblies with direct bonding using nanotwinned copper (NTC). An example microelectronic assembly may include a first microelectronic component and a second microelectronic component coupled to the first microelectronic component by a direct bonding (DB) region, wherein the DB region includes a DB contact comprising a first portion and a second portion having different microstructures. The first portion is between the first microelectronic component and the second portion. The second portion is between the first portion and the second microelectronic component. In some implementations, the first portion has non-columnar microstructure, and the second portion has columnar microstructure. In some implementations, less than about 40% of grains of the first portion have ac <111> orientation, and at least about 50% of grains of the second portion have the <111> orientation. In some embodiments, the first portion includes PCC or FGC, and the second portion includes NTC.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile