Vivek Chidambaram

Title: Innovations by Vivek Chidambaram

Introduction

Vivek Chidambaram is a notable inventor based in Singapore, SG. He has made significant contributions to the field of technology, particularly in the area of wafer bonding and chemical sensor packaging. With a total of four patents to his name, Chidambaram continues to push the boundaries of innovation.

Latest Patents

One of his latest patents is a method for low temperature bonding of wafers. This method involves providing a first wafer with an exposed first layer made of a first metal and a second wafer with an exposed second layer made of a second metal. The first and second metals are capable of forming a eutectic mixture with a eutectic melting temperature. The process includes contacting the first layer with the second layer and applying a predetermined pressure at a temperature below the eutectic melting temperature to create a solid-state diffusion bond.

Another significant patent is a chemical sensor package designed for highly pressured environments. This package includes an encapsulation that houses a chemical sensor and features a hole for exposing the chemical-sensitive part of the sensor. Additionally, it incorporates a pressure balancing structure that helps to balance the pressure applied to the sensor at its sensitive part.

Career Highlights

Chidambaram is currently associated with the Agency for Science, Technology and Research, where he continues to innovate and develop new technologies. His work has been instrumental in advancing the capabilities of chemical sensors and wafer bonding techniques.

Collaborations

He has collaborated with several talented individuals, including Daniel Rhee Min Woo and How Yuan Hwang, contributing to a dynamic and innovative work environment.

Conclusion

Vivek Chidambaram's contributions to technology through his patents and collaborations highlight his role as a significant inventor in the field. His innovative methods and designs continue to influence advancements in technology.