Agency for Science, Technology and Research

Vivek Chidambaram

Daniel Rhee Min Woo

How Yuan Hwang

Eva Leong Ching Wai

Jong Bum Lee

Yuen Sing Chan

Ranganathan Nagarajan

Beng Yeung Ho

Jinghui Xu

Ling Xie

Sunil Wickramanayaka

Bangtao Chen

Zhipeng Ding

Li Yan Siow

A method for bonding wafers is provided. The method comprises the steps of providing a first wafer having an exposed first layer, the first layer comprising a first metal; and providing a second wafer having an exposed second layer, the second layer comprising a second metal, the first metal and the second metal capable of forming a eutectic mixture having a eutectic melting temperature. The method further comprises the steps of contacting the first layer with the second layer; and applying a predetermined pressure at a predetermined temperature to form a solid-state diffusion bond between the first layer and the second layer, wherein the predetermined temperature is below the eutectic melting temperature.

Method for low temperature bonding of wafers

A package for a chemical sensor including an encapsulation and a pressure balancing structure is disclosed. The encapsulation encapsulates a chemical sensor and has a hole for exposing a chemical sensitive part of the chemical sensor. The pressure balancing structure balances pressure applied to the chemical sensor at the chemical sensitive part.

Chemical sensor package for highly pressured environment

The invention relates to a layer arrangement and a wafer level package comprising the layer arrangement, and in particular, the layer arrangement comprises a getter layer and further comprises a sacrificial layer. The wafer level package may be used in microelectromechanical systems (MEMS) packaging at a vacuum level of about 10 mTorr or less such as close to 1 mTorr (i.e. MEMS vacuum packaging).

Layer arrangement and a wafer level package comprising the layer arrangement

Growing community of inventors

Singapore, Singapore

Vivek Chidambaram